Ansys Strengthens Collaboration With TSMC On Advanced Node Processes Certification And 3D Integrated Circuit Multiphysics Design Solutions

Author: Benzinga Newsdesk | April 23, 2025 03:02pm

AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications

/ Key Highlights 

• TSMC and Ansys advance AI-assisted workflows to support design optimization during technology node migration and photonic design optimization with TSMC's Compact Universal Photonic Engine (COUPE) platform
• Ansys RedHawk-SC™ and Ansys Totem™ power integrity and electromigration reliability platforms and Ansys RedHawk-SC-Electrothermal™ multiphysics platform are certified for TSMC's latest A16™ process
• Ansys HFSS-IC Pro system-on-chip (SoC) electromagnetic solution is certified for TSMC's 5nm and 3nm process

PITTSBURGH, April 23, 2025 /PRNewswire/ -- Through continued collaboration with TSMC, Ansys (NASDAQ:ANSS) today announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are also extending tool certification for the newly announced N3C technology, based on available N3P design solutions.

Posted In: ANSS TSM