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GlobalFoundries' 12LP FinFET Tech Powers BAE Systems' Custom Radiation-Hardened Chips For Space Applications

Author: Benzinga Newsdesk | November 19, 2025 11:59am

GlobalFoundries (NASDAQ:GFS) (GF) today announced that BAE Systems will use GF's advanced FinFET semiconductor technology in a new offering for space applications. Securely manufactured at GF's facility in Malta, New York, this technology enables BAE Systems and others to create highly differentiated chips for electronic systems to withstand the harsh environment of space.

With its new RH12™ Storefront, BAE Systems, using its intellectual property and design techniques, has created a turnkey solution to allow for the rapid development of custom radiation-hardened semiconductor solutions for space applications. These chips are manufactured using GF's high-volume commercial 12LP FinFET technology platform that delivers excellent processing performance, secure connectivity, exceptional power efficiency and reliability for demanding applications such as space avionics and telecommunications. With integrated features for RF, low-power memory and logic, the 12LP platform enables customizable, compact designs for increasingly complex technologies that handle processing and connectivity.

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