| Ticker | Status | Jurisdiction | Filing Date | CP Start | CP End | CP Loss | Deadline |
|---|
| Ticker | Case Name | Status | CP Start | CP End | Deadline | Settlement Amt |
|---|
| Ticker | Name | Date | Analyst Firm | Up/Down | Target ($) | Rating Change | Rating Current |
|---|
New semiconductor nanofabrication facility will support advanced research and workforce development opportunities
YORKTOWN HEIGHTS, N.Y. and DAYTON, Ohio, Nov. 19, 2025 /PRNewswire/ -- IBM (NYSE:IBM) and the University of Dayton today announced an agreement for the joint research and development of next-generation semiconductor technologies and materials. The collaboration aims to advance critical technologies for the age of AI including AI hardware, advanced packaging, and photonics.
To support the collaboration, IBM will contribute state-of-the-art semiconductor equipment to the University of Dayton for a new semiconductor nanofabrication facility on the university's campus. With a planned completion in early 2027, the facility will serve as a hub for advanced semiconductor research and workforce development, providing hands-on, lab-to-fab learning opportunities for University of Dayton students and researchers.
Additionally, the research initiatives under this agreement will be guided by a dedicated University of Dayton faculty member and IBM Technical Leader, giving students and researchers the opportunity to work side-by-side with industry and academic experts.
Posted In: IBM
